2009²Ä¤T©¡¿nÅé¥ú¾÷¹q¬ì§Þ»P´¼¼z°]²£Åv¹ê°È¬ã°Q·|
¤¤µØ¥Á°ê¿nÅé¥ú¾÷¹q¬ì§Þ¨ó·|¡B¸gÀÙ³¡¼Ð·ÇÀËÅ秽¡B¤¤µØ¹q«H¬ã¨s©Ò¡B°ê¥ß¥xÆW¤j¾Ç¡B¤¤µØ¬ì§Þ¤j¾Ç¡B±X¤s¬ì§Þ¤j¾Ç°t¦X¬F©²¦b°ê®aµo®i«ÂIp¹º¤¤¿n·¥±À°Ê¡u²£·~¬ãµo³Ð·s¡v¥H´£¤É²£«~°ªªþ¥[»ùÈ¡A¿n·¥°ö¨|¿nÅé¥ú¾÷¹q¬ì§Þ»P´¼¼z°]²£Åv¹ê°È¤H¤~¡C±N©ó98¦~8¤ë6¤é°²°ê¥ß¥xÆW¤j¾Ç¹q¾÷¨t¹q¾÷¤GÀ]105ºtÁ¿ÆU¡AÁ|¿ì¡i2009²Ä¤T©¡¿nÅé¥ú¾÷¹q¬ì§Þ»P´¼¼z°]²£Åv¹ê°È¬ã°Q·|¡j¡C¬ã°Q·|±NÁܽв£©x¾Ç¬É±M®a¾ÇªÌµoªí±MÃDºtÁ¿¡A¨ÃÁܶ°¦U¤j±M°|®Õ¤Î²£·~¬É¬ÛÃö»â°ì¾ÇªÌ±M®a§ë½Z¨Ãµoªí½×¤å¡A¥H«P¶i²£¡B©x¡B¾Ç¡B¬ã¶¡¤§¾Ç³N¤Î§Þ³N¥æ¬y¡C
¡@
¿nÅé¤Æªñ¬õ¥~ÀË¥ú¾¹¤Î¨äÀ³¥Î
Ò\¤¸¥ú
³Õ¤h
¤¤µØ¹q«H¬ã¨s©Ò
©Òªø
ªñ¬õ¥~¥úÀ³¥Î
1)
¥e¤Ó¶§¥ú¯à¶q¬ù40%-50%¤§¤ñ¨Ò¡G¤Ó¶§¹q¦Àµ¥¡F
2)
¦bSilica¥úÅÖ¤¤¶Ç¿é¨ã¦³§C·l¯Ó¡B§C¦â´²¤§¯SÂI(1310nm&1550nm)¡G¥ú³q°T¡B¥úÅÖ»·ºÝ±´´ú¾¹µ¥¡F
3)
°ª¤ô§l¦¬±`¼Æ(Peak@1450nm&1940nm)¡G»sµ{®ðÅé§tÀãºÊ´ú¡B¹«~°®ÀêºÊ´ú¡B¹A²£¿z¿ï¡B§@ª«¦¨ªøºÊ´ú¡B¯È±i°®ÀêºÊ´ú¡B»sÃĹLµ{°®ÀêºÊ´ú¡B¦Ù½§«OÀã°»´ú¡B¸¦w¡]°£¦B¡^Àˬdµ¥¡F
4)
¬ï³zµW·ã½è¤Î³Ì¨Î¸ÑªR¤HÅé²Õ´ªí¥Ö¤§ªi¬q(1300nm)¡Gø쾦Àˬd¡B¦P½Õ¥úÂ_¼h±½ºË(OCT)¡B¦Ù½§¬ü®eµ¥¡F
5)
Eye-Safeªi¬q(>10mW@1550nm)¡G¹p®g´ú¶Z¡B©]¶¡®ü¨¾ºÊµø¡B¯µ±KºÊµøµ¥¡F
6)
¥i¬ï³zªo¾¥¡A¦ýµLªk¬ï³zºÒ¸ñ¡GªoµeŲÃѤÀªR¡B¶r¨é¿ë°°¡B¨Æ¬GŲÃѵ¥¡F
7)
1200nmªiªø¥H¤W¥i³zµøª¿´¹¶ê¡G´¹¶ê¯Ê³´À˵ø¡B¿ü²y°}¦C(Ball-Grid
Array, BGA)±µ¦XÀ˵ø¡BMEMS«Ê¸Ë¡B´¹¶ê¯Å«Ê¸Ë(Wafer-Level
Package, WLP)À˵ø¡B´¹¶ê¯Å¥ú¾Ç¤¬³s(Wafer-Level
Optical Interconnect)
杭F
8)
²[»\C-H¡BN-H¡BC-O¤ÎO-Hµ¥¤À¤l³¡¤À¤§Vibrational
Overtone States¡G¹«~¡B¹}®Æ¦¨¤À¤ÀªR¡B»sÃĦ¨¤À¤ÀªR¡B¦å²G¤ÀªR¡B®ðÅé°»´ú¡B¤u·~¦Ã¬VÀË´ú¡B»sµ{¤ÏÀ³ºÊ´ú¡B»»´ú¤ÀªR(¤ÓªÅ¡B¦aªí)¡B«OÄÖ²y¹DÀ˵ø¡B¦^¦¬¶ì½¦¤ÀÃþ¡BªoµeŲÃѤÀªR¡B¦D¨Æ²{³õ»`ÃÒ¡BÆpªoºÊ´ú¡B¥Û¤Æ»s«~(ªo«~)¤ÀªR¡B¯]Ä_ŲÃÑ¡B¶r¨é¿ë°°¡B¦Ãªd¼ö³B²zµ¥¡F
9)
Rayleigh
´²®g¤Î
Mie
´²®g®ÄÀ³¡G¤õ¨a±Ï¨a¡B¿@Ãú¥æ¦wµ¥¡C
¤¤µØ¥Á°ê¿nÅé¥ú¾÷¹q¬ì§Þ¨ó·|
¾G¤ì®ü1*¡B¼B¨|¹F1¡B½²¿o°í2,
3
1°ê¥ß¤¤¤s¤j¾Ç
¥ú¹q¤uµ{¾Ç¨t
2°ê¥ß¤¤¤s¤j¾Ç
¾÷±ñ»P¾÷¹q¤uµ{¾Ç¨t
3¥¿×¬ì§Þ¤j¾Ç ¾÷±ñ¤uµ{¨tº[¾÷¹q¤uµ{¬ã¨s©Ò
ºKn
§Q¥Î¾÷ºc¤Î¹q±±§Þ³N¡A¬I¥[¤@¶g´Á©ÊÅܰʩΩw¶q¤§¤O¯x©óª½®|125
mm¥úÅÖ¡A¥i¸g¥Ñ¤@¦¸¦¨«¬»sµ{¬ã¿i¦UºØ§Îª¬¥úÅÖ³zÃè¡]¬ã»s¦¨«~¦n¤ñÃÀ³N¤Æ¤§²£«~¡^¡A¨Ò¦p¾ò¶êÀ@«¬¡BÀ@¦¡·¤«¬¡B¤T¨¤À@«¬¡B¥|¨¤À@«¬¡B¤¨¤À@«¬¤Î¤»¨¤À@«¬¡C¨ä¤¤¾ò¶êÀ@«¬¡BÀ@¦¡·¤«¬»P¥|¨¤À@«¬¸ò°ª¥\²v¹p®gµ²¦X¡A¨ä½¢¥ú®Ä²v¶W¹L80¢H¡A¬°¥ú³q°T¨t²ÎÀ³¥Î¤¤¡A§C¦¨¥»¤§³Ì¨Î³s±µ¾¹²£«~¡A¨ã¦³¥ú³q°T²£·~§Q¥Î©Ê¡C
Ching-Ting
Lee (§õ²M®x)*¡BTsung-Hsin
Lee (§õ©v«H)
Institute of
Microelectronics, Department of Electrical Engineering,
National Cheng Kung
University 701, Tainan, Taiwan, Republic of China
Abstract
Recently, there has been a great interest in
electromagnetic field sensors to protect biological and natural
environment against unhealthy effects of the electromagnetic
field. Therefore, the electromagnetic field detective technology
will be respected gradually. The accurate electromagnetic field
detective system will be contributive to the study in biology
and environment ecology.
In this study, we devoted to research and
develop the applications of Mach-Zehnder modulator with
micro antenna in electrooptical
electromagnetic sensors. In this sensor system, we study
the basic configuration of the no bias Mach-Zehnder modulator,
high sensitivity micro antenna and the packaged module of fiber
coupling with electrooptical
electromagnetic detective system. We have fabricated and
improved several kinds of different
designed electrooptical
electromagnetic sensors. According to the experimental
results, it is expected that this integrated structure of
electromagnetic field sensor can be potentially employed in
electromagnetic measurement.
Toward Integrated
Biosensor with OLED-based Plasmonic Device
ªL±Ò¸U
Lin, Chii-Wann
°ê¥ß¥xÆW¤j¾Ç
¥ÍÂå¹q¤l»P¸ê°T¾Ç¬ã¨s©Ò
±Ð±Â
¥»¬ã¨s©Ò´£¥X«e¤³Ð·s«¬¥Íª«Âå¾Ç·P´ú§Þ³N¡A¥H¹q¿Eµo¤èªk¦b·P´úª÷ÄݤW²£¥Í¦Ûµo©Êªí±¹q¼ß¦@®¶ªi²{¶H¡Aª½±µ¶i¦æªí±¥Íª«¤À¤l¿@«×ÀË´ú¡A¦Ó¤£»Ý¿Ã¥ú¼Ð¥Ü¡C¥»³]p¬ãµo¬°¤@ºØ¥D°Ê¦¡¹q¿Eµoªí±¹q¼ß¦@®¶ªi¾÷¨î¡A¨äÀuÂI¬°¤£»Ýn¥~¥[¹p®g¿Eµo¥ú·½¤Î¥ú¾Ç·¥¤Æ¤ù¡A¥i¹F¨ìÆF±Ó«×°ª¡B§Ö³t¥B¥i§Y®É¶q´ú¥\¯à¡Aª½±µ¦b·P´ú¤¸¥ó¤W§Ö³t¶i¦æ¥Íª«¤À¤l¶q´ú¤ÀªR¡C
¶Wµªi¤j«¬Ä²±±»È¹õ¤§¶}µo
©P¤¸ÌÄ
¥xÆW¤j¾Ç¾÷±ñ¨t±Ð±Â
¨t²Î¬[ºc¡X¹B§@¤è¦¡

¥ú¹q²£·~¤§ª§³^®×¨Ò¦^ÅU»PµûªR
¹ùÅ㫶
¥xÆW¬ì§Þ¤j¾Ç
±Ð±Â
¬ì§Þªk«ßºÓ¤h
¤¤µØ¥Á°ê¥òµô¨ó·|
¥òµô¤H
1.
±M§Q¯S©Ê
2.
±M§Q§x¹Ò»P¶D³^®×¨Ò
3.
±M§Q¨¾¶Dµ¦²¤
4.
±M§Q«IÅv§PÂ_·Ç«h
±M§Q´N¬O¸ê²£:
Á`¸ê²£¡×¬y°Ê¸ê²£¡Ï©T©w¸ê²£¡ÏµL§Î¸ê²£¡Ï´¼¼z°]²£Åv
³o¨Ç¦~¨Ó¡A¥xÆW°ª¬ì§Þ¼t°Ó¦b¨ü¨ì±M§Q¶D³^¤§W«á¡A¤]§ë¤J¥iÆ[¤§¬ãµo¸g¶O¡Aº¥¥Ñ±M§Q¨¾¿mÂà¤Æ¬°±M§Q§G§½»P«Ø¥ß±M§Qµ¦²¤Áp·ù¡A«ö¦¹ÁͶյo®i±N¥i³v¨B´£¤É²£·~Ävª§¤O¡C°ê¤º¼t°ÓÀ³´x´¤ÃöÁä§Þ³N¤§±M§Q¡A¥H¹ï§Ü°ê¥~¼t°Óªº«Â¯Ù¡C´x´¤¥þ²y¥Dn°ê®aªk³W¸ê°T¡A¤ÀªRÃöÁä±M§Q»P°jÁסC
±M§Q¶D³^¹ê¨Ò¤ÀªR
¥DÁ¿¤H¡G§f
Z
©÷
´¼¼z°]²£ªk°|§Þ³N¼f¬d©x
³ü¡B±M§Q¶D³^«n©Ê
¶L¡B±M§Q¶D³^Åé¨î¤¶²Ð
°Ñ¡B±M§Q¶D³^¤§§ðÀ»¤èªk
¸v¡B±M§Q¶D³^¤§¨¾¿m¤èªk
¥î¡B±M·~§Þ¯à«n©Ê
³°¡Bµ²½×
³Ð·N»P±M§Q
¥DÁ¿¤H¡G¶À¥»¥ß
´¼¼z°]²£ªk°|§Þ³N¼f¬d©x
2009-001
¾÷¹q³]³Æ»PºÊ±±¸ê®Æ¦¬¶°¨t²Î§Þ³N¾ã¦X¤§¬ã¨s¡Ð¥H¹q¼ßº²¿ÄÄlºÊ±±¨t²Î¬°¨Ò
Study on the System Integration of
Mechatronic Devices, Data Acquisition,Monitoring and Control:
Example of Plasma Furnace System
¼B±o¬F1¡B¤ý«Tµ{2¡B§d^¯³3
1
ªF«n¬ì§Þ¤j¾Ç¾÷¹q¾ã¦X¬ã¨s©Ò¬ã¨s¥Í
2
ªF«n¬ì§Þ¤j¾Ç¾÷¹q¬ì§Þ¾Ç¨t 3
²M¶³¬ì§Þ¤j¾Ç¹q¸ê¾Ç°|
ºKn
¥»¤å¤¶²Ð¥ú¾÷¹q¬ì§Þ¨t²Î¾ã¦X¤§¹ê°È®×¨Ò¡C¹q¼ßº²¿ÄÄl¨t²Î¥i¤À¬°¶i®Æ¨t²Î¡B¹q¼ß³B²z¥DÅé«Ç¡B¹q¼ß¤õ¬²¨t²Î¡]¥]¬A¹q·½¨ÑÀ³¨t²Î¡B¤õ¬²¶Ç°Ê¨t²Î»P»öªí±±¨î¨t²Îµ¥¡^¡B¤G¦¸¿U¿N«Ç¡B¼o®ð³B²z»P±Æ©ñ¨t²Î¡Bº²´í±Æ¥X¨t²Îµ¥¥Dn³]¬I¡A¨Ã¥B¤]¥]¬A®ðÅé¬y¶q±±¨î¡B®ðÅé¨ÑÀ³¨t²Î¡B§N«o¨t²Î¡B·Å«×¡BÄl¤º¥~À£®t¤Î¼o®ðºÊ±±¨t²Îµ¥¦¸nªþÄݳ]³Æ¡C¥»¬ã¨s¤§ºÊ±±¸ê®Æ¦¬¶°SCADA¨t²Ît³d¾ãÓ»sµ{µ{§ÇÅܼƪººÊµø¤Î±±¨î¡A¾ã¦X¦U¨t²Î±±¨î¾¹¡A¸g¹Lethernetºô¸ô³q°T¡A±N¦U¤l¨t²Î¤§©Ò¦³ºÊ±±¸ê®Æ¯Ç¤J¸ê®Æ³B²z¥D¾÷¸ê®Æ®w¤¤¡A§Q¥Î¹Ï±±¤H¾÷¤¶±Åã¥Ü»P±±¨î¡A¨Ã´£¨Ñ¤H©Ê¤Æ¤¶±¨ÏºÞ²z¯à¹F¨ì¹q¸£¤Æ¡B¦Û°Ê¤Æ»P¸ê°T¤Æ¥Øªº¡C¬°¸¨¹ê§C©ñ®g©Ê¼o±óª«¤§´î®e³B²z¡A°ê¤º¬Y®Ö¯à¬ã¨s³æ¦ì«Ø³yº®y¤w¦b¹BÂध¹q¼ßµI¤Æº²¿ÄÄl¡A´Á±æ¯à¹F¦¨¼o®Æ¤Å»ÝÀˤÀ¡A³B²zµ{§Ç²¤Æ¡A¼o®Æ´î®e¼W¤j¡A©T¤Æ¦¨«~¦w©w¡A¦A¶i¦Ó±À®i¨ì°ê¤º¦U¶µ¤u·~¼o®Æ³B²z¡A¥H½T«OÀô¹Ò¦w¥þ¤Î¼W¶iªÀ·|ºÖ¬çªº²z·Q¥Ø¼Ð¡C¥»¤åÂǦ¹®×¨Ò»¡©ú¾÷¹q³]³Æ»PºÊ±±¸ê®Æ¦¬¶°¨t²Î¤§§Þ³N¾ã¦X¬ã¨s¡A¨Ã±j½Õ¨ä¤¤ªº¥iµ{¦¡±±¨î¾¹PLC¡B¤H¾÷¤¶±HMI»P¸ê®Æ®wµ¥³nÅéÀ³¥Î¹ê°È§Þ³N¡C
2009-002
¸³±ÓøÊ ªL§g©ú
¤¤µØ¤j¾Ç ¾÷±ñ¤uµ{¬ã¨s©Ò
ºKn
¥»¬ã¨s¬O¥Dn¬O°Q½×§Q¥Î°ª¶¥¸ÉÀv§ïµ½¦UÃn¥ú¾÷¤§¤@P©Ê(Improve
Scanner Matching)¡A¨Ï¥Î©ó¥b¾ÉÅé¶À¥ú»sµ{¥Í²£¾÷¥x¡A¥]¬A¥ú¸n»s§@¡B¼Ð·Ç®Õ¥¿´¹¤ù»s§@¡B¶À¥ú¥Í²£¾÷¥xÃn¥ú¾÷(Scanner)Ãn¥úµ{¦¡¤§«Ø¥ß¼Ò¦¡¡B°ïÅ|¹ï·Ç(Overlay)¶q´ú¾÷¥x¶q´úµ{¦¡¤§«Ø¥ß¡A¤ÀªR¶À¥ú¥Í²£¾÷¥xÃn¥ú¾÷¾÷¥x»P¾÷¥x¶¡¤§¤@P©Ê(Match)»~®t¶q¡A´£¤É²£¯à§Q¥Î²v»P²£«~¤§¨}²v§ïµ½(Yield
Improve)¡C§Q¥Î²{¥N¤Æ¥b¾ÉÅéµL¹Ð«Ç¡A©Ò¾Ö¦³ªº¸ê·½»P³]³Æ¡A·f°t²{¦³¶À¥ú»sµ{³]³Æ¤§°ò¦¡A³]pµo®i¤@®M§ïµ½¾÷¥x¶¡¤§»~®tªº¨t²Î¡A¥H¦]À³¾÷¥x©Î¹Lµ{(Process)©Ò³y¦¨¤§´Ý¶q(Residual)¡C¶Ç²Îªº¡§Matching
Matrix¡¨¤èªk´yøÃn¥ú¾÷¤@P©Ê(Scanner
Matching)©Ò§Q¥Î¤§°²³]Ãn¥ú¾÷§ÎÅÜ¥\¯à¬OÀRºAªº¡A³Ì·sªºÃn¥ú¾÷Ãn¥ú¼Ò¦¡¥i§Q¥ÎÃn¥ú¾÷¤@P¤Æ(Scanner
Match Maker : SMM)¨t²Î¡Apºâ¤Î½Õ¾ã¾÷¥xÃn¥ú®ÉÃn¥ú¾÷¤§§ÎÅÜ¡A¦³®Äªº§ïµ½´£°ªÃn¥ú¾÷¾÷¥x¸s²Õ°ïÅ|¹ï·Çªº©Ê¯à(Overlay
Performance)¡AÅýÃn¥ú¾÷¦³§ó¦hªºÆF¬¡©Ê¡A¥i²V¦X·f°tÃn¥ú²Õ¦X¡A¨Ï²£«~°ïÅ|¹ï·Ç¸ê®Æ¤§|Mean|+
3sigmaÅãµÛªº´£°ª¤F¡A¤]¬Û¹ï´£°ª¤F¥Ø«e¼h§O(Layer)»P¼h§O(Layer)¤§¶¡ªº°ïÅ|²V¦X·f°t¡C
2009-003
¬_®]°í1 ¡BªL²Q®S2
1¤¤µØ¹q«H¬ã¨s©Ò «e¤¬ã¨s«Ç
2»OÆW¬ì§Þ¤j¾Ç
¹q¤l¤uµ{¬ã¨s©Ò
ºKn
°w¹ï¥Ø«e³Ì¨ã¹ê¥Î¤Æªº¨âºØWDN-PON§Î¦¡¡ARSOA«¬WDM-PON¨t²Î»P¥ú¿EÂê¼ÒFP¹p®g«¬WDM-PON¨t²Î´£¥X¥úÅÖÂ_½u§Y®ÉºÊ´ú³]p¡A§Q¥Î¤£¦PºÊ´ú¥ú·½»P¥úÅÖ¥ú¬]°t¦X¡AÂǥѤϮg¨äºÊ´ú¥ú§@¬°§PÂ_ºô¸ô°j¸ô¬O§_Â_½uªº¨Ì¾Ú¡A¦P®É¶q´ú¸ÓºÊ´ú³]p¹ï¶Ç¿é©Ê¯àªº¼vÅT¨Ãµû¦ô¨ä¯S©Ê¡C
2009-004
¤ÑµM¦â¯À¯»¥½¬V®Æ±Ó¤Æ¤Ó¶§¯à¹q¦À©ó¶ì½¦³nªO¤W¤§»s§@»P¯S©Ê¤ÀªR
ªL§g©ú1 ¡B¶À¤¯³Ç2
1¤¤µØ¤j¾Ç ¾÷±ñ»P¯è¤Ó¬ã¨s©Ò
2¤¤µØ¤j¾Ç
¹q¾÷¤uµ{ºÓ¤h¯Z(¥ú¹q²Õ)
ºKn
¥»¬ã¨s¬O©ó¶ì½¦³nªO¤W¶i¦æ¤ÑµM¦â¯À¯»¥½¬V®Æ±Ó¤Æ¤Ó¶§¯à¹q¦À¤§»s§@»P¯S©Ê¤ÀªR¡A¦bTCO
PET¶ì½¦°òªO³n©Ê°ò§÷¤W¡A»s§@ITO³z©ú¾É¹q½¤¡BTiO2©`¦Ì¶Ç¾É¼h¡BºÒ¹q·¥¡B¾Tºä¹q·¥¡B»É¹q·¥¡C¨Ã©ó±Ð¾Ç¹êÅç«Ç¤¤¥H¦Û»s¹êÅç©Ê½èªº¬V®Æ±Ó¤Æ¤Ó¶§¹q¦À¡A¶i¦æ¯S©Ê¤ÀªR¡C
2009-005
±ÛÂà¸WÃè§Þ³N¦b±j¤ÆÂù²´µøı§Þ¥©ªºÀ³¥Î
ªô®¶ùÚ1¡B¶À«¶»¢2¡B³¯¼w½Ð1
1
³{¥Ò¤j¾Ç¹q¾÷¤uµ{¾Ç¨t
2 A+1ºë«~²´Ãè·§©À舘
ºKn
¥»¬ã¨s¥H¡y±ÛÂà¸WÃè¡z¨Ó©ñÃP²´²yªº¥~²´¦Ù¡B¯}ÃaÓÅ骺µøı²ßºD¡B«·s¶ì³yµøı¼Ò¦¡¡A¶i¦Ó´£¤Éµøıªí²{ªº¤èªk¡C¹B¥Î±ÛÂà¸WÃè²£¥Í¥ú¾Ç¸ô®|°¾§é¡B±ÛÂ઺¯S©Ê¡A¨Ï±oÂù²´µøı¦b¬ï³z¸WÃ褧«á¡A¼v¹³²£¥Í¤ÀÂ÷¡B¿Ä¦X¡B¦A¤ÀÂ÷ªº¤ÏÂаʧ@¡A¨Ï¥~²´¦Ù²£¥Í©Ôºò»P©ñÃPªº¦ùÁY¹B°Ê¡C¦bªì¨B°V½m«á¡A©}¥ú«×§C©ó-1.00Dªº¸s²Õ¡A°´T°ª¹F53.9%¡A-2.00Dªº¸s²Õ°´T°ª¹F47.3%¡F±×¦ì¶q3¡µ¥H¤Uªº¸s²Õ¹F¨ì100¢Hªº§ïµ½¡AÁ`Å饧¡È¦³47.5%ªº§ïµ½¡C¦b³sÄò7¤Ñ°V½m«á¡A©}¥ú«×§C©ó-1.00Dªº¸s²Õ°´T°ª¹F59.1%¡A-2.00Dªº¸s²Õ°´T°ª¹F54.7%¡B±×¦ì¶qªºÁ`Å饧¡È¦³55.2%ªº§ïµ½¡C¥»¬ã¨s½T»{±ÛÂà¸WÃè¥i¥H¹F¨ì±j¤Æ²´·úµøıªº§Þ¥©¡A¶i¦Ó´£¤ÉÓÅ骺¤u§@®Ä²v»P·Ç½T«×¡A¨Ã¥B¯à°÷§ïµ½µøı¼Ò¦¡¡A¨Óº¡¨¬ÓÅ骺»Ý¨D¡C
2009-006
Soft-contact Lens¦b¬W¶b°¾²¾ªº¤ÀªR»P§Ö³t×¥¿ªº±´°Q
¬x¹ÅÁo1¡B½²§Óª@2¡B³¯¼w½Ð1
1.
³{¥Ò¤j¾Ç¹q¾÷¤uµ{¾Ç¨t
2.
Ãè¦K¤u³õ²´Ã褽¥q
ºKn
¦b©}¥ú²§±`(Refraction
Error)¤H¤f¼Æ©~°ª¤£¤Uªº¥xÆW¡A´²¥ú(Astigmatism)¬O°£¤Fªñµø²´(Myopia)»P»·µø²´(Hyperopia)¤§¥~ªº¡A¥t¤@ºØ§ó¬°½ÆÂøªº©}¥ú²§±`¡C¥»¤å°w¹ï²y¬W±Ãè¦b³n¦¡Áô§Î²´Ãè(Soft-contact
Lens)ªº¬W¶b(Axis)ÁB¥¿»~®t(Error)¶i¦æ¬ã¨s»P±´°Q¡C¥Ñ²y¬W±Ã誺ÁB¥¿¶i¦æ¹êÅç¡A¥Ñ¹êÅçµ²ªG¥[¥H¤ÀªR(Analysis)¡A¨Ã¶i¦æ¹êÅç×¥¿(Correction)¡C°w¹ï³n¦¡Áô§Î²´Ã誺ºD©Ê±ÛÂà¶i¦æ¹êÅç¡A¨Ã¥B¸g¥Ñ¹ê»Ú¸Ë°t¸mÅçÃÒ¡F²Îp¼Æ¾Ú¤¤Åã¥Ü¡A¦pªG³n¦¡Áô§Î²´Ãè´²¥úÃè¤ù¶È¥H¤£¦PªºÃ©w«×³]p(Design)(¦p¡G¤ô¥¦¡¡B«««¦¡»PºI±¦¡)¨Ó§ïµ½»~®t¡A±¹ï¦UºØ¤£¦PÃþ«¬²´·ú©Ò²£¥Íªº»~®t¡A¨ÃµLªk¹F¨ì¥þ±©Êªº®ÄªG¡C¹êÅçµ²ªGÃÒ©ú¡A·í©}¥ú²§±`ª¬ºA³z¹L³n¦¡Áô§Î²´Ãè´²¥úÃè¤ù¨ÓÁB¥¿®É¡A·í²£¥ÍError
of Axis¦ÓP¨Ïµø¤OȵLªk´£¤É®É¡A±Ä¥Î¡u¶¶¥[°f´î¡v¼Ò¦¡ªº×¹¢¤è¦¡¡A·|¤ñ§ó´«¤£¦PDesignªº³n¦¡Áô§Î²´Ãè´²¥úÃè¤ù¡A§ó¯à§Ö³t¹F¨ìµø¤O«~½èéwªº®ÄªG¡F±N§ó´«³n¦¡Áô§Î²´Ãè´²¥úÃè¤ù³B¤èªº¦¸¼Æ¡A©Ò±a¨Óªº¤H¤O·l¯Ó¡B²£«~¦¨¥»ªº·l¯Ó¡B®ø¶OªÌ«H¤ß«×°§Cªº¨¤«×¨Ó¬Ý¡A¡u¶¶¥[°f´î¡v¬O³Ì¹ê¥Î¡B³Ì¸gÀÙ¡A¥B³Ì²z·Qªº×¥¿¤è¦¡¡C
2009-007
»²¥H¯à¶qºÞ²zµ¦²¤¤§¤Ó¶§¯à»P·¤O½Æ¦Xµo¹q¨t²Î¤§³]p»P¹ê²{
¶À¥ò´Ü1¡B½²¬F§»2*¡B·¨·ç¿ö2¡B½²©v§Ó1
1°ê¥ß¥xÆW¬ì§Þ¤j¾Ç¹q¾÷¤uµ{¾Ç¨t
2¤¤µØ¬ì§Þ¤j¾Ç¹q¾÷¤uµ{¾Ç¨t
ºKn
¥»¤å¦b³]p¤Î»s§@¤@»²¥H¯à¶qºÞ²zµ¦²¤¤§¤Ó¶§¯à»P·¤O½Æ¦X«¬µo¹q¨t²Î¡A¸Ó¨t²Î¥Hª½¬y/ª½¬y¤ÉÀ£«¬¥\²vÂà´«¾¹(dc/dc
boost power converter)¬°¥D¶b¡A·f°t³Ì¤j¥\²v°lÂÜ(maximum
power point tracking)±±¨îªk«h¡A¨Ï±o¤Ó¶§¯à¹q¦À»P·¤Oµo¹q¾÷¯à°÷¿é¥X³Ì¤j¥\²v¡C¥t¥~¡A¤å¤¤¥ç´£¥X¥Hª½¬y¤É/°À£¦¡ºIªi¾¹(dc
boost/buck chopper)§@¬°»W¹q¦ÀÀx¡BÄÀ¯à±±¨î¡A¨Ó§¹¦¨¨t²Î¯à¶q¥¿ÅºÞ²z¡A´£°ª¨Ñ¹qªº¥i¾a«×¡C¦bµo¹q¨t²Î¤è±±Ä¥Î¤T¬Û¤T¶¥¼hÅܬy¾¹(three-phase
three-level dc/ac inverter)§@¬°ª½¬y/¥æ¬yÂà´«¤§¥Î¡A¦]¬°¤T¶¥¼h¬[ºc¯à°÷´î¤Ö¿é¥X¹qÀ£¤§¿Óªi§t¶q¡A¨Ã¥B±N¦A¥Í¯à·½(renewable
energies)¿é¥X¤§ª½¬y¹qÂàÅܦ¨¥æ¬y¹q¡A¨Ñµ¹¤T¬Ût¸ü¿W¥ß¨Ï¥Î©Î¶Ç¿é¦Ü¹q¤Oºô¸ô¡A¹F¨ì¤À´²¦¡¨Ñ¹q¨t²Î(distributed
generatedsystem)¤§¥\¯à¡C
2009-008
ºÏÅK¦¡¥D¯Å¤Ï®gÃè¬ã»s
³¯¼w½Ð
³{¥Ò¤j¾Ç¹q¾÷¤uµ{¾Ç¨t
ºKn
ºÏÅK¦¡¥D¯Å¤Ï®gÃè¬O¥ú¾Ç¦¡ªûÁ³»öªºÃöÁä¹s²Õ¥ó¡A¦]¬°ªûÁ³»öªº¯S®í»Ý¨D¡AºÏÅK¦¡¥D¯Å¤Ï®gÃ襲¶·¦P®É¨ã³Æ¥ú¾ÇÃ豤κϩʪº¨â¤j¥\¯à¡A¨ä»s³y§Þ³N¸û¤@¯ë¥ú¾ÇÃè¤ù¬°§xÃø¡CºÏÅK¦¡¥D¯Å¤Ï®gÃè¬ã»s¥DnÃöÁä§Þ³N¬°¡G(a)¥ú¾ÇÃ豬ã»s»sµ{³]p¡A(b)ºÏÅK°ò§÷¿ï¾Ü¡A(c)°ò§÷¹qÁá¥[¤u¡A(d)»É¥ú¾ÇÃ豬ã¿i©ß¥ú¡B¤Î(e)¥ú¾ÇÃè±¥ú¾Ç´ú¸Õ¡C¥»¬ã¨s§¹¦¨5mm«p«×»É¤Î¥¾ã«×¡Ø£f(£f=0.6328£gm)¥ú¾Ç¥±Ãè¡C
2009-009
¦bMIMO-OFDM¨t²Î¤¤¨Ï¥Î·s«¬SFBC½s½XªºPAPRÁY´î§Þ³N
¼Ú¶§·½
³¯Þ³¦p
ªø©°¤j¾Ç
¹q¾÷¤uµ{¬ã¨s©Ò
ºKn
¤U¤@¥N¦æ°Ê³q°T©Ò°l¨Dªº¥Ø¼Ð¡A§Y¯à´£¨Ñ§ó°ªªº¶Ç¿é³t²v¡B¶Ç¿é®e¶q¡C¦h¿é¤J¦h¿é¥X¤§¥¿¥æ¤ÀÀW¦h¤u(multiple-input
multiple-output orthogonal frequency division multiplexing, MIMO
OFDM)
±N¦¨¬°¥¼¨Ó4G¼eÀW³q°T¨t²Îªº¥Dn§Þ³N¡F»POFDM¨t²Î¤@¼Ë¡AMIMO-OFDM¨t²Î¦³µÛ¥Dnªº¯ÊÂI´N¬O¶Ç¿é°T¸¹¨ã¦³¸û°ªªº®pȹ不¡¥\²v¤ñ(peak-to-average
power ratio, PAPR)¡A©Ò¥H¥»½g¤¤§Ú̱N¨Ï¥ÎªÅÀW°Ï¶ô½X(space-frequency
block coding, SFBC)ªº½s½X¬[ºc¡AÀ³¥Î¦bMIMO-OFDM¨t²Î¤¤¡A¨Ã´£¥X·s«¬ªºSFBC¬[ºc¨Ó°§CPAPR¡C·s«¬ªºSFBC¬[ºcÀuÂI¬°µ²¦Xselective
mapping(SLM)ªºÆ[©À¤]¯à¥H·s«¬ªº³q¦¡³Q§ä¥X¥B²Å¦XSFBCªº¥¿¥æ©Ê¡A©ó±µ¦¬ºÝªºcombining
scheme¤]¤£·|¼W¥[¨ä¹Bºâªº½ÆÂø«×¡C¸g¥Ñ¼ÒÀÀµ²ªG¥i¥H±oª¾¨äPAPRÈ»P¨ä¥L¶Ç²Î¤èªk¦b
ªº±ø¥ó¤U¦³±Nªñ1dBªº§ïµ½¡C
2009-010
Äõ§JÁɳ洹Åé»s³y»P¼ö¬y¤ÀªR
Manufacture and Thermal Fluid Analysis of
Langasite single crystals
¤ò¤j³ß¡B¦¿õ²»
¤¤µØ¬ì§Þ¤j¾Ç¹q¤l¤uµ{¨t
ºKn
¥»¤å¨Ï¥Î±q«Xù´µVNIISIMS¬ã¨s¾÷ºc´£¨ÑªºCzochralski³æ´¹ªø´¹Äl(Kristall
3M)¡A¥ÍªøÄõ§JÁÉLGS(Langasite)³æ´¹´¹Åé¡C³oºØ·s«¬À£¹q§÷®Æ¦³Åé¿n¤p¡B§Cªý§Ü¤Î°ªÀW¼e¡A¥iÀ³¥Î©óªí±Ánªi(surface
acoustic wave¡ASAW)¡BÅéÁnªi(body
acoustic wave¡ABAW)¡B®¶Àú¾¹¡B¦@®¶¾¹¡B©µ¿ð¾¹¡BLÀ£ÀË´ú¾¹µ¥¡A¬O³Ì¨ã¼ç¯àªº§÷®Æ¡C
¤w¦¨¥\¦a¥Íªø¥X¥xÆW²Ä¤@Áûª½®|3.5¤½¤À¡B°ª«×12.5¤½¤À¡B«¶q540§JªºÄõ§JÁɳ洹´¹Åé¡A¨Ã¥HXRD¶q´ú¤Î©Ô°Ò¥úÃлö¤ÀªR¨ä¯S©Ê¡C¦P®É¥»¤å±Ä¥Î¤ÀªR³nÅéCOMSOL¶i¦æ¼ÆȼÒÀÀ¡A¥H¤ÀªR©XÁ示´¹´Îªø´¹¤§·Å«×³õ¤Î¬y³õÀH®É¶¡¡B«¤O¡B´¹´Î¤Î©XÁ礧±ÛÂ൥ÅܼÆÃö«Y¡C
§õ«T¼ü¡B¼B«T½n¡B·Å«Ø¾ð¡B¿à^Ä£¡B§d«Ø§Ó¡B´^¶©Ãv
°ê¥ß¥xÆW¤j¾Ç ¥ú¹q¤uµ{¬ã¨s©Ò
ºKn
¥»½g½×¤å¥Dn¥HºUÂø®ñ¤ÆÁâ¦@º²à·»Ä¾Y¬°§÷®Æ¡A¬ã»s¶g´Á©Ê·¥¤Æ¤ÏÂà¿ÀW¹p®g´¹¤ù¡A¥Ø¼Ð¬°ÂǥѦ¹´¹¤ù¹F¦¨¿é¤J1064
nmªº¬õ¥~¥ú¿ÀW²£¥Í532
nmªººñ¥ú¡CºUÂø®ñ¤ÆÁâ¦@º²à·»Ä¾Y¸û¥¼ºUÂøªÌ¨ã¦³¸û°ªªº§Ü¥ú§éÅܯà¤O¡A§Æ±æÂǦ¹´£°ª¿ÀWÂà´«®Ä²v¡C
§ÚÌ¥H¥»¹êÅç«Ç¦b¥¼ºUÂøªº¦@º²à·»Ä¾Y¤W¦¨¥\ªº°ª¹qÀ£P·¥¤Æ¤ÏÂàªk¬°°ò¦¥[¥H§ï¨}¡A¦b«p«×¬°0.5
mmºUÂø®ñ¤ÆÁâ෻ľY´¹¤ù¦¨¥\¬ã»s¥X³Ì¤p¶g´Á¬°13.8
ƒÝm¡B´¹¤ùªø«×»P«p«×¬°6
mm»P0.5
mmªº²Ä¤G¶¥¤@ºû¶g´Á©Ê·¥¤Æ¤ÏÂàºUÂø®ñ¤ÆÁâ෻ľYºñ¥ú¿ÀW¹p®g´¹¤ù¡A¥Hªiªø¬°1064
nm¤§Nd
: YVO4©`¬í¤G·¥Åé¹p®g¶i¦æºñ¥ú¿ÀW¹êÅç¡A¦b50
MW/cm2¤§©`¬í¬¦®ú±ø¥ó¤U¤§¥X¥ú®Ä²v¬ù¦b35
%¡A¤J®g120
mW¤U¥i±o¨ì42.8
mWªººñ¥ú¡C
2009-012
¤G¬q¦¡³zÃè¥úÅַǪ½¾¹ªºµo´²¨¤¬ã¨s
Investigation of Divergence Angle for
2 Segment
Lensed Fiber Collimator
ªL౫°,±i®a»¨,§õ®iºÓ,¿½¦t¼w,³¯¹ÅÂ@
¥xÆW®ç¶é¿¤»Ê¶Ç¤j¾Ç¹q¤l¤uµ{¾Ç¨tº[¬ã¨s©Ò
ºKn
§Ú̱N¤@¬qª½®|¬°140£gmªºº¥Åܦ¡§é®g²v¦h¼Ò¥úÅֿıµ¨ì¤@¬qª½®|125£gmªºµLÅÖ®Ö¥úÅÖ¡A¦A§Q¥ÎµLÅÖ®Ö¥úÅֿıµ¨ì³æ¼Ò¥úÅÖ¡A±Nº¥Åܦ¡§é®g²v¥úÅÖ§@¬°³zÃè¡A§Î¦¨¤G¬q¦¡³zÃè¥úÅַǪ½¾¹¡C²z½×³¡¤À¡A¥H½Æ¼Æ¥ú§ô°Ñ¼Æªk(
complex beam parameter method )¤ÎABCD¯x°}§@¥ú§ô¼ÒÀÀ¡A·íµLÅÖ®Ö¥úÅÖªø«×©T©w¬°350£gm¡Aº¥Åܦ¡§é®g²v¦h¼Ò¥úÅÖªºªø«×¬°170¡Ó5£gm¥B¥ú·½ªiªø¬°1.31£gm¡A¥i¶q´ú¨ì³Ì¤pµo´²¨¤1.5«×¡C
2009-013
¥úÅ֤Ϯg¦¡©I§l·P´ú¾¹¤§»s§@
Fabrication of Reflective Optical Fiber Respiratory Sensor
ªL౫°,§E±¶¦p,¸â¥@»Í,½²¨Î®¦,±i®a»¨
¥xÆW®ç¶é¿¤»Ê¶Ç¤j¾Ç¹q¤l¤uµ{¾Ç¨tº[¬ã¨s©Ò
ºKn
¡@¡@§Ú̧Q¥Î¤@¬qª½®|¬°140mmªºº¥Åܦ¡§é®g²v¦h¼Ò¥úÅÖº²±µ¦Ü¤@³æ¼Ò¥úÅÖªº§ÀºÝ¡A»s³y¥X¦¹¬ã¨s©Ò¨Ï¥Îªº³zÃè¥úÅÖ¡C§Ų́ϥγzÃè¥úÅÖ§@¬°©I§l·P´ú¾¹¡A¥Ñ¦h¦¸©I§lªº«½Æ©Ê¹êÅç¥iª¾¡A³zÃè¥úÅ֨㦳¸û°ª¤Ï®g¶q®t¤Î°ªÃ©wªº¯S©Ê¡C³zÃè¥úÅÖ»P²{¦b¬ÛÃö³]³Æªº©I§lºÊ´ú¾¹¬Û¤ñ¡A¤£¦ýÅé¿n¤j´T´î¤p¥B§Q©ó¤è«KÄâ±a¡A¦¨¥»¤]¬Û¹ïªº¸û§C¡C¦]¦¹¡A³zÃè¥úÅÖ¬Û·í¨ã¦³µo®iªº¼ç¤O¡C
2009-014
»·¬õ¥~½u¿n¤À²y³]p
³¯¼w½Ð1
§õ¥@¤å2
³\¶hµ¾1
Á©v¾§1
1³{¥Ò¤j¾Ç¹q¾÷¤uµ{¾Ç¨t
2¤¤µØ¬ì§Þ¤j¾Ç¹q¾÷¤uµ{¾Ç¨t
ºKn
¥»¬ã¨s¥Øªº¥Dn¦b¶i¦æ»·¬õ¥~½u¿n¤À²yªº³]p¡Cº¥ý¨Ì¾Ú¿ç®gì²z©M¬õ¥~½u¿ç®g¶q´ú»Ý¨D¨Ó³]p»·¬õ¥~½u¿n¤À²y¡C¦]¬°¤£¦P¬õ¥~½u¿ç®g¶q´ú»Ý¨D·|¼vÅT¨ì¿n¤À²yªº³]p¡A¨Ò¦p¡G³æ¦Vªº¥ú·½(ex:¹p®g)¡B¥þ¤è¦Vªº¥ú·½(ex:¿Oªw¡BÂI¥ú..etc)¡B¤Î¼s¨¤ªº¥ú·½ªº¿n¤À²y³]p«¬¦¡³£¤£¤@¼Ë¡C¦b½T©w¿n¤À²y«¬¦¡¤§«á¡A¶i¦æ²z½×³]p¡A§Q¥Î¥ú¾Ç³nÅ骺¶i¦æ¼ÒÀÀ¡A¥H¨D±o¸û¨ÎȰѼƪº³]p¡C¥»¬ã¨s§¹¦¨¤º®|¡B¥~®|¡B¤Î«p«×¦U¬°50mm¡B52mm¡B¤Î2mmªº¿n¤À²y³]p¡C¿n¤À²y¤º¼h¶î®Æ¿ï¨úinfragold¤Ï®g²v¹F95%¡C
2009-015
¥HHBT-MOS-NDR¤¸¥ó³]p¨ã°ª°£ÀW¦]¯À¤§°£ÀW¾¹¹q¸ô
³¯«a¦t1*¡B¥Ì¼s©z2¡B½²º«¶¯1
1±X¤s¬ì§Þ¤j¾Ç
¹q¤l¤uµ{¾Ç¨t
2¹Å¸q¤j¾Ç
¹q¾÷¨t
ºKn
¦¹½×¤å±N§Q¥Î·s«¬HBT-MOS-NDRt·L¤À¹q¸ô¨Ó¹ê²{¤@ºØ·s«¬ªº°£ÀW¾¹¬[ºc¡A¦¹¬[ºc¥u»Ýn¤@Áû¹q·P¡B¤@Áû¹q®e¡B¥H¤Î¤@ÓHBT-MOS-NDR¹q¸ô²Õ¦¨¡A¬O¤@ºØ¬[ºc²³æªº¹q¸ô¡C¦b°ªÀW¶q´ú®É¡A¥u»Ý¦b¿é¥XºÝ¦A¥[¤W½w½Ä¾¹(buffer)ªº³]p¡C§ÚÌ¥i¥HÂǥѱ±¨î¿é¤JÀW²v¡B¹qÀ£µ¥µ¥¨Ó±o¨ì¤£¦Pªº°£ÀW¦]¯À(divided
factor)¡C¥Ñ©ó¥»½g½×¤å¦³¨âºØHBT-MOS-NDR¬[ºc¡A±N¼ÒÀÀ«á©Ò±o¨ìªº¼Æȸg¹L¤ñ¸û«á¥i¥Hµo²{¡At¹qªý°Ï°ìªº½d³ò¤j¤p±N·|¼vÅT°£ÀW¾¹ªº°£ÀW½d³ò»P°£ÀW¦]¯À¤j¤p¡A¸g¥Ñ¾A·í³]p¡A¦¹°£ÀW¾¹¬[ºcªº³Ì°ª°£ÀW¦]¯À¥i¹F20¥H¤W¡C¦¹°£ÀW¾¹¹q¸ôªº³Ì¤jÀuÂI¦b©ó§ÚÌ¥i¥Î¼Ð·ÇBiCMOS»sµ{¨Ó³]p»P¹ê²{¡C
2009-016
±i´IÀï1* ¡B§E¬L©ú2
1°ê¥ßÁp¦X¤j¾Ç ¹q¾÷¤uµ{¨t
2¤u·~§Þ³N¬ã¨s°|¶q´ú§Þ³Nµo®i¤¤¤ß
ºKn
¥»¤å±N´£¥X¡u¥H¼Ð·Ç¥ÕÂI¬°°ò¦¤§¦Û°Ê¥Õ¥¿Åºtºâªk¡v¡A§â¼v¹³«H¸¹¹ïÀ³¦ÜxyY¦â±mªÅ¶¡¡A¦AÂǥѼзǥÕÂIpºâ¥X¦Û°Ê¥Õ¥¿Å©Ò»Ýªº¦â±m¼W¯qÈ¡C¨ä¥Dn¯S¦â¬O°£¤F¥i¹F¦¨Gray
World Assumptionµ¥±`¥Î¤èªkªº¥Õ¥¿Åµ²ªG¥~¡A§ó¥i¦b¾Ç²z¤W»P¨ú¹³³]³Æ©Ò©w¸q¤§¼Ð·Ç¥ÕÂI§¹¥þ§k¦X¡C¦¹¥~¡A°w¹ïNTSC¡A±Ä¥ÎAltera¤½¥qCyclone´¹¤ù¡A¥H³nµwÅé¦@¦P³]p¤è¦¡¡A¹ê»Ú³]p¥»ºtºâªk¤§SOPC¹q¸ô¡C¨ä¤¤CPU®Ö¤ß¬°NiosII¡At³d¦â±mªÅ¶¡Âà´«»P¼W¯qÈpºâ¡A¨ä¾l¥\¯à¸gVHDL¥HµwÅé¤è¦¡§¹¦¨¡C©Ò¹F¦¨ªº³B²z³t«×¬O¨C¬í30Óµe±¡A±N¥i§¹¥þº¡¨¬µø°T¤Î®É¦Û°Ê¥Õ¥¿Å¤§»Ý¨D¡I
2009-017
±i®a²»1*¡B½²º«¶¯1¡B¥Ì¼s©z2
1±X¤s¬ì§Þ¤j¾Ç
¹q¤l¤uµ{©Ò
2°ê¥ß¹Å¸q¤j¾Ç
¹q¾÷¤uµ{¾Ç¨t
ºKn
¦b¥»¤å¤¤¡A§ÚÌ´£¥X¥H®t°Ê©ñ¤j¾¹ªºì²z¡A¼ÒÀÀ¥X¼eÀWÀ£±±®¶Àú¾¹(Wide-Band
Voltage
Controlled Oscillator)¡C©óTSMC
0.18£gm»sµ{¤¤¡A¼ÒÀÀ¥X¦b¤u§@¹qÀ£¬°1.8
V®É¡AVCO¿é¥X®¶ÀúÀW²v¬°3066
MHz¡C±±¨î¹qÀ£¥Ñ0.9
V¨ì1.8
V¡A®¶ÀúÀW²v±q163
MHz¨ì3066
MHz¡AÀW²v¥i½Õ½d³ò(Tuning
Range)¬°
2903MHz¡A®¶ÀúÀW²v¸ó§tVHF(30M~300MHz)©MUHF(300M~3000MHz)¤§½d³ò¡A½ÕÅÜÀW¼e½d³ò(Tuning
Bandwidth)°ª¹F179.7%¡A¬Û¦ìÂø°T¤è±¡A¬Û¦ìÂø°T(Phase
noise)¦b1MHz°¾²¾®É¬°-141.4
dBc/Hz¡A¦b100KHz°¾²¾®É¬°-136.6
dBc/Hz¡A¿é¥X¥\²v(Output
Power)¬°5.312
dBm¡A®ø¯Ó¥\²v(Power
Consumption)¬°24.4
mW¡A®Ä¯à«ü¼Æ(FOM)¬°-197.2
dB¡C
2009-018
¥H¨ã¦³°ª®pÈ»P¨¦È¹q¬y¤ñ¤§¦hÈ°O¾Ð¾¹¹q¸ô³]p»PÀ³¥Î
Multiple-Valued
Memory Circuit Design with High Peak-to-Valley Current Ratio
³¯«Û¨Z1*¡B¥Ì¼s©z2¡B½²º«¶¯1
1¨p¥ß±X¤s¬ì§Þ¤j¾Ç
¹q¤l¤uµ{¾Ç¨t
2¹Å¸q¤j¾Ç
¹q¾÷¤uµ{¾Ç¨t
ºKn
¦b¥»½g½×¤å¸Ì§Ú̩ұĥΪºt·L¤À¹qªý¤¸¥ó(Negative
Differential Resistance , NDR)¬°£N«¬MOS-HBT-NDR©MN«¬MOS-HBT-NDR¡A«eªÌ¥Ñ2ÓMOS»P1ÓHBT¤§¤¸¥ó©Ò²Õ¦¨¡A«áªÌ«h¬°£N«¬NDR¦A¨ÃÁp1ÓMOS¤¸¥ó©Ò²Õ¦¨¡C§ÚÌ¥i¥HÂǵۦêÁp©Î¬O¨ÃÁpªº¤è¦¡²Õ¦X¼ÆÓMOS-HBT-NDR¤¸¥ó¡A«h¥i¥H§Q¥Î¤¸¥ó¥»¨¨ã¦³§éÅ|®ÄÀ³ªºI-V¦±½u¯S©Ê¡A¶i¦Ó²£¥Í¦h®pÈ(Multi-Peak)¹q¸ô¡A¦Ó±N¹qªý§@¬°t¸ü(load)¡A¨Ã¥BÂǵۿï¾Ü¤£¦Pªº¿é¤J¹qÀ£¤è¦¡來¨ú±o¿é¥X¡A¨Ã°t¦XBiCMOS»sµ{來³]p¦hÈ°O¾Ð¾¹¡C§Q¥Î³o¼Ëªº¯S©Ê¡A§ÚÌ¥i¥H´î¤Ö¹q¸ô©Ò»Ýªº¤¸¥ó¼Æ¨Ã¥B°§C¹q¸ôªº½ÆÂø«×¡C
2009-019
¶À^¾±¡B林®¥¬F¡B¤ý®üµY¡B¬_®]°í¡B¹ùªK©ô
¤¤µØ¹q«H¬ã¨s©Ò «e¤pµe¬ã¨s«Ç
ºKn
¦bWDM-PON¬[ºc¤¤¤À§O¨Ï¥ÎDFB-LD¤ÎRSOA·íCOºÝ»POUNªº¥ú·½¡A¤U¶Ç°T¸¹ªº¥ú©ú·À¤ñ(ER)·|¤zÂZ¨ì¤W¶Ç°T¸¹ªº¯S©Ê¡C§Ú̦bRSOA¤§«e©ñ¸mÂùÁû§C¤Ï®g²vFP-LD¡A³oÂùÁû§C¤Ï®g²vFP-LD¥Dn±N°ª¥ú©ú·À¤ñªº¤W¶Ç°T¸¹À£ÁYÅܦ¨§C¥ú©ú·À¤ñ©Îªñ¦üª½¬y¥ú¡A¦¹¥úª`¤JRSOA«á¶i¦æ¦A½ÕÅܤW¸ü¤W¶Ç°T¸¹¡A°§C¤U¶Ç°T¸¹¤zÂZ¨ì¤W¶Ç°T¸¹ªº¶Ç¿é«~½è¡A¨CÓONU¥úµo®g±µ¦¬¾÷¤´µM«O«ùµL¦â¥ú·½ªº¯S©Ê¡C¤U¶Ç°T¸¹¤§ER¤j©ó8dB¡A¤W¶Ç1.25Gbpsªº°T¸¹¨ä¥\²v¬°-21dBm®É¡A¨ä»~½X²v¥i¹F10-12¡C
2009-020
¨Ï¥ÎSTBC½s½X¬[ºcªº·s«¬MIMO-OFDMÀW²v¦P¨B§Þ³N
¼Ú¶§·½
J´Â©ö
ªø©°¤j¾Ç
¹q¾÷¤uµ{¬ã¨s©Ò
ºKn
MIMO-OFDM¨t²Î¹ï©óÀW²v°¾²¾«D±`ªº±Ó·P¡A¦b±µ¦¬ºÝ±µ¦¬¨ìªº°T¸¹¦³ÀW²v°¾²¾®É¡A¤l¸üªi¤§¶¡ªº¥¿¥æ©Ê±N³Q¯}Ãa¨Ã¥B²£¥Í¤l¸üªi¶¡ªº¤zÂZ¡A¦]¦¹»Ýn°µÀW²v¦P¨B¡C³o½g¤å³¹§ÚÌ´£¥X¤@Ó·sªºÀW²v¦P¨B§Þ³N¦bMIMO-OFDM¨t²Î¡C¥»½g¤å³¹¤¤§Ú̦b´£¥X·sªº°V½m§Ç¦C¡A¬[ºc¤W¨Ï¥Î¤FªÅ®É°Ï¶ô½X(STBC)§Ç¦C¡AµM¦Ó´£¥Xªº°V½m§Ç¦C¤£¦ý¥i¥H°µ®É¶¡¦P¨B§ó¥i¥H¶Ç°e¸ê®Æ¡A¼ÒÀÀµ²ªG¡A§ÚÌ©Ò´£¥Xªº¤èªk¸ò¤åÄm¤¤¤TºØºtºâªk°µ¤ñ¸û¡A§ÚÌ©Ò´£¥Xªº¤èªk¦b¦h«¸ô®|¤U¾ãÅé®Ä¯àªºÀW²v°¾²¾¦ôp©úÅã¦n«Ü¦h¡C
2009-021
³¯¶©«Ø1*¡B¤ý«T³Ç2¡B³¯¥¿±j3¡B©P¨|¥¿4
1°ê¥ß¥x¥_¬ì§Þ¤j¾Ç
¥ú¹q¤uµ{¨t
ºKn
¥»¬ã¨s«Y¨Ï¥Î¤Æ¾Ç»k¨è¤è¦¡»s§@¦h¤Õª¿°òªO¡AµM«á¦b¨ã¦³¦h¤Õª¿ªº©`¦Ì¤Õ¬}ªºª¿°òªO¤W»s§@¤Ó¶§¯à¹q¦À¡C¥H¹q¤lÅã·LÃè¤U¥iÆ[¹î¨ì¤Æ¾Ç»k¨è¤è¦¡»s§@§¹¦¨ªº¦h¤Õª¿°òªO¡AÀHµÛ½Õ¾ã¹qÀ£§ïÅܹq¬yÈ¡A¬Û¹ïªº¤p¤Õ®|ªº¤Õ¬}¼W¥[¡C¨Ï¥Î¤Æ¾Ç»k¨è¤èªk¦b¨ã¦³¦h¤Õª¿ªº©`¦Ì¤Õ¬}ªºª¿°òªO¤W¨I¿n¦³¾÷§÷®Æ¡A¥i¥H§Q¥Î¤£¦Pªº»k¨è¹qÀ£¡B»k¨è®É¶¡¤Î·»²G¿@«×½Õ¾ã¤Ï®g²v¡A±N¦³¾÷-µL¾÷¬É±ªºP-N¤¶±Âà´«¦¨¹q¯à¡C¨ã¦³©`¦Ì¤Õ¬}ªºª¿°òªO¤Wªº¤Ï®g²v°±N¥i§C¨ì5%¥H¤U¡C
2009-022
¤ý¤hÞ³1*¡B¥Ì¼s©z2¡B±i°öµØ1
1¨p¥ß±X¤s¬ì§Þ¤j¾Ç
¥ú¹q¤uµ{©Ò
2°ê¥ß¹Å¸q¤j¾Ç
¹q¾÷¤uµ{¨t
ºKn
¥»½g½×¤å¬O¥H¥Õ¥úªí±ÂHµÛ¦¡(surface
mount device¡ASMD)
µo¥ú¤G·¥Åé(Light-Emitting
Diode¡ALED)»P¬õ¡BÂÅ¡Bºñ¤T¦â5£XLED§@¬°°ö¾i´Óª«¤§¥ú·½¡A±´°QLEDªº¥úªiªø¬O§_·|«P¶i©Î§í¨î´Óª«¤§¥Íªø¡C¥»¦¸¹êÅç¬[ºc¨Ï¥Îºñ¨§]¬°Æ[¹î¹ï¶H¡A¥H©w¹q¬y¹q¸ôÅX°ÊLED¯x°}¡A±Ä¥Î«Ê³¬ªº¤ì½c¹jµ´¨ä¥L¥ú·½¤§¼vÅT¡A¨Ï´Óª«¥u¯à°÷¨ü¨ìLED©Ò·Ó®g¨ì¤§¥ú·½¥Íªø¡AÂǦ¹´ú¶qLED¹ï´Óª«¥Íªø©Ò²£¥Íªº¼vÅT¡Aµ²ªGÅã¥Ü·Ó®g¹LSMD¥Õ¥úLED¤§«áªººñ¨§]¡AµL½×¬O°ª«×¡B¸¤ù¼Æ¡B¤À¤ä¼Æ³£Àu©ó¤é¥ú¿O»P5£XLED·Ó®g¹L«á¤§¨§]¡A¦s¬¡²v¤]¸û¨ä¥L²Õ°ª¡A¨Ã¥B¥i¦b¤£¤ä¼µªºª¬ºA¤U«ùÄò¥Íªø¡C
2009-023
¥ú¿EÂê¼Ò¤Àªi¦h¤u³Q°Ê¥úºô路
林®¥¬F¡B¶À^¾±¡B¬_®]°í¡B¤ý®üµY¡B¹ùªK©ô
¤¤µØ¹q«H¬ã¨s©Ò
«e¤§Þ³N¬ã¨s«Ç
ºKn
¥»¤å說©ú¥H¥ú¿EÂê¼Òì理«Ø¸m¤§¤Àªi¦h¤u³Q°Ê¥úºô路¬[ºc¡A¥H¥~³¡¼eÀW¥ú·½BLS¥ú·½³q¹L¤Àªi¤¸¥óÀWÃФÀªi«á§Î¦¨¯¶ÀW¥ú·½¿EµoFP-LDÂê¼Ò«á¨Ï¤§§Î¦¨³æ¤@¼ÒºA雷®g¡A¥H¦¹µL¦â¥ú·½¨ú¥NDWDM
DFB¥úµo°e¼Ò²Õ¡AÂÇ¥Ñ1.25GbpsÀW率½ÕÅÜ¡A®Ç¼Ò§í¨î¤ñSMSR°ª¹F30dB¡A¦bªiªøÂê©wFP-LD¿é¤J½ÕÅÜ°T¸¹PRBS¡R231-1¡A量´úÅã¥ÜªiªøÂê¼Ò1%ºÝ±§Ü¤Ï®g率FP-LD¦b³æ¼Ò¥úÅֶǿé20
km«á´ú±oªº°T¸¹²´¹Ï(Eye
Diagram)¨ä½ÕÅܳt率¥i³q¹L1.25
Gbps²´¹Ï¾B¸n(Eye
Mask)¡A¨ÃÂÇ¥ÑEthernet
1000 Base-T¶i行數¾Ú¼vµ¤T¦X¤@ªA°È(Triple
Play Service)´ú¸Õ¡A¦b³æ¤@¥Î¤á½u路¤¤¦P®É¶Ç°e-1ÀW¹D»yµ/¼vµ³q°T¡B71ÀW¹D°ªµe½è¼vµ¹qµøµø°T¡AÃÒ©ú1%ºÝ±§Ü¤Ï®g率FP雷®gÀ³¥Î¦b1.25
Gbps¤Àªi¦h¤u-³Q°Ê¤¸¥ó¥úºô路(WDM-PON)¾Ö¦³·¥°ªªº¼ç力¡C
2009-024
DVB-H¤â¾÷¹qµø¦b¥xÆW¦æ°Ê³q°T·~ªº³Ð·sµ¦²¤
DVB-H in
Taiwan Telecommunication Progress and Roadmap
¤ý©É
Evangeline Yi WANG
°ê¥ß¥xÆW¬ì§Þ¬ì§Þ¤j¾Ç ºÞ²z¬ã¨s©Ò³Õ¤h¯Z
¤¤¤åºKn
¦æ°Ê¹q¸Ü´£¨Ñ²{¥N¤H³q°T«K§Q¤§¥~¡A¤â¾÷ªþ¥[¥\¯à¤]¤£Â_±À³¯¥X·s¡A´£¨Ñ®ø¶OªÌ¦b¥Í¬¡¤¤¤£¥i©Î¯ÊªºªA°È¡A¤â¾÷¹qµø´N¬Oªþ¥[¥\¯à·í¤¤¡Aݨã§Y®É©Ê¤Î«K§Q©Êªº·s¥\¯à¡C¥xÆW¦b1997¦~¶}©ñ¥Á¶¡·~ªÌ¸gÀç¦æ°Ê³q°T·~¤§«á¡A¤]´£¨Ñ¦U¶µ¥[ȪA°È¡A¤â¾÷¹qµø¥ý«e¦³3G·~ªÌ´£¨Ñ¦æ°Ê¹qµø¦¬µøªA°È¡A¦Û2006¦~°_¸Õ¼½DVB-H¤â¾÷¹qµø¡A¨ã¦³¬Ù¹q¸`¯à¤Î´£°ª®Ä²vªºÀuÂI¡A¨Ã¥i´£¨Ñ®ø¶OªÌÂù¦V¤¬°Ê¥\¯à¡A¥¼¨Ó¥iݨã®T¼Ö©Ê¤Î´£¨Ñ·~ªÌ¹ï¥Î¤á¥t¤@¦æ¾PºÞ¹D¡C
¦ýDVB-H¤â¾÷¹qµøÂǥѼs¼½¶Ç¼½¼Ò¦¡´£¨ÑªA°È¡A¥Ñ©óÀW¬q¬°°ê®a¸ê·½¡A¥Ñ¥DºÞ¾÷Ãöµoµ¹°ê¤º¤®aµL½u¹qµø¥x°õ·Ó¡A¬°¤@¯S³\¨Æ·~¡A¦ýµL½u¹qµø¥x¥²¶·µ²¦X¦æ°Ê³q°T·~ªÌ¤Î¾ã¦X¤W¤U´å·~ªÌ¡A¦@¦P«Øºc¥¥x¡A¤~¯à°÷´£¨Ñ§¹¾ã¦Ó¨ã¥[ȪA°Èªº¥\¯à¡C¥»¬ã¨sÂǥѲ`«×³X½Íªk¡A°Q½×¥xÆW¬ì§Þ·~¦b¤â¾÷»s³y¬ÛÃö§Þ³N¨ã¦³§¹¾ã¤Î°ª«×¬ãµoªºÀu²§¯à¤O¡A¥Ñ¤W´å¤â¾÷¤Î¥ô¦ó¤â«ù¦¡¸Ë¸mªº¬ãµo³]p»s³y¡A¨ìµL½u¹qµø¥x´£¨Ñ¼½¬M¸`¥Ø¤ÎªA°È¡A»P¦æ°Ê³q°T·~ªÌ´£¨Ñp¶O¤ÎªA°È¡A¦X§@«Øºcªº¥¥x¡A¨Ã»¡©ú²£·~Ãì²Õ¦¨¦]¤l¦b¦X§@«ØºcªA°È¥¥x¤W©Ò§êºtªº¨¤¦â¤Î¥¼¨Óµo®iµ¦²¤¡C¥»¬ã¨s´£¥X¹ï¥xÆWµo®iDVB-H¤â¾÷¹qµø¥¼¨Óµo®i¤§³Ð·sµ¦²¤ªº«Øij¡C
2009-025
GaAs/SiÂù±µ±¤Ó¶§¯à¹q¦À¤§ä¡Á¡½¤¹ï©³¼hª¿¤Ó¶§¯à¹q¦À¤§±´°Q
©P¨|¥¿¡B¦ó¤å³¹¡BÚ¬®Ñ·Ô¡B¦¶«Û¿o
°ê立¥x北¬ì§Þ¤j¾Ç ¥ú¹q¤uµ{¨t
ºKn
¤@¯ë來說Âù±µ±¤Ó¶§¯à¹q¦À¦h¬O利¥Î磊´¹(Monolithic
Grown)ªº¤è¦¡»s§@¡A¦ý¦b³æ´¹ª¿(Si)¤W¨Ã不¯à磊´¹良¦n«~½èªº¯~¤ÆñS(GaAs)µ²ºc¡A¬G§Ú̹Á¸Õ¹B¥Î´¹¶ê±µ¦X(Wafer
Bonding)¥H¤Î磊´¹½¤é離(Epitaxial
Lift-Off, ELO)ªº§Þ³N¡A來»s§@GaAs/SiÂù±µ±¤Ó¶§¯à¹q¦À¡C¥»½g論¤å±´°Qªº«ÂI¡A§Y¬°°w¹ï´¹¶ê±µ¦Xªº¤¤¶¡±µ¦X¼h(Intermediate
Layer)金ÄÝä¡(In)¡A¹ï©óÂù±µ±¤Ó¶§¯à¹q¦À¤§¤¤ª¿¤Ó¶§¹q¦À©Ò³y¦¨ªº¼vÅT¡C§ÚÌ¥ý»s§@¥X¤@³æ´¹ª¿¤Ó¶§¯à¹q¦À¡A±µµÛ¹B¥Î¹q¤l§ô»]Á᪺¤è¦¡¦b³æ´¹ª¿°òªO¤WÁá¤W¤@¼h«p度¬°29nmªº金ÄÝä¡Á¡½¤¡A¼ÒÀÀ¬°´¹¶ê±µ¦XªºÂHµÛ¼h¡C³Ì«á±N¨SÁá¤W©M¦³Áá¤W金ÄÝä¡Á¡½¤¤§ª¿¤Ó¶§¯à¹q¦À¤À§O¥HAM1.5G(100mW/cm2)ªº¤Ó¶§¯à¥úÃÐ¥H¤Î25¢JªºÀô¹Ò¤U¶i行I-V¯S©Ê¦±½u量´ú¡C·íª¿¤Ó¶§¯à¹q¦ÀÁá¤W金ÄÝä¡Á¡½¤«á¡Aµu路¹q流±K度(Short
Circuit Current Density, Jsc)降§C45%¡B¶}路¹qÀ£(Open
Circuit Voltage, Voc)¨Ç·L¤U降¡B¶ñ¥R¦]¤l(Fill
Factor, FF)´£¤É24%¥H¤ÎÂà´«®Ä率(Conversion
Efficiency, £b)降§C33.3%¡A³o¨Ç數¾Ú¦³§U©ó§ÚÌ¥¼來¶i行GaAs/SiÂù±µ±¤Ó¶§¯à¹q¦Àªº§ï¶i參¦Ò¡C
2009-026
1550
nm³·±Y¥ú¤G·¥Åé³æ¥ú¤l¯S©Ê»P¤u§@©ó³Q°Ê§í¨î¼Ò¦¡±´°Q
³¯©É»«¡B¦ó¤å³¹¡Bªô«Ø¶£¡B³¯¬F¾§¡B劉¬FªN¡B林õ¥Á
°ê立¥x北¬ì§Þ¤j¾Ç ¥ú¹q¤uµ{¨t
ºKn
¥»¤å¤¤利¥Î³·±Y¥ú¤G·¥Åé(Avalanche
Photodiode¡AAPD)¤§¤º³¡µ¥®Ä¼Ò«¬來±´°Q¨ä¾Þ§@©ó³æ¥ú¤lÀË´ú(Single
Photon Detection)¤¤ªº¯S©Ê¤ÀªR¡A¨Ãµ²¦X³Q°Ê§í¨î(Passive
Quenching)¹q路ªº¤è¦¡來¬[³]¤@®M¥ú¤lÀË´ú¨t²Î¡C³z¹L量´ú·tp數率(Dark
Count Rate¡ADCR)¡BÀË´ú®Ä率(Detection
Efficiency¡ADE)¤ÎÂø°Tµ¥®Ä¥\率(Noise
Equivalent Power¡ANEP)µ¥不¦P參數來±´°QAPD¹ï©ó¥ú¤lÀË´úªºªí²{¡C¥»¹êÅ礤©ÒÀò±o¤§³Ì§CDCRªºÈ¬°2.2¡Ñ106
c/s¡ADE¬°7.5%¡ANEP¬°5¡Ñ10-15
W/Hz1/2¡C
2009-027
Performance
of InP Solar Cell based on Spin-on-Film (SOF) AR-Coating Process
C. L.
Chen (³¯ªø利)1,
W. J. Ho (¦ó¤å³¹)1,
Y. J. Wu (§d¤¹¤¤)2,
Y. J. Lin (林逸¤¯)1¡¯
and
C. M. Yen (ÄY±Ò»Ê)1
1
Department of Electro-Optical Engineering, National Taipei
University of Technology
2
Institute of
optoelectronic sciences, National Taiwan Ocean University
Abstract
A
study aimed at simplified solar cell fabrication using
spin-on-film (SOF) technology. Owing to its potential low cost,
reduced complexity and adaptability to large scale batch
processing, SOFs processing are desirable techniques for solar
cells fabricated. The reflection spectrum analysis shows that
the spin-on film TiO2
thin
films on Si-wafer have a low reflection of 3% in wavelength of
550-610 nm. We have successfully fabricated p+-n
InP solar cells of 8.29% and 8.89% conversion efficiency with
single/multi layer spin-on TiO2,
SiO2/TiO2
AR
coating, respectively.
2009-028
InGaAs/InP³æ¥ú¤l³·±Y«¬ÀË¥ú¤G·¥Å餸¥ó»s§@»P¤ÀªR
劉¬FªN¡B¦ó¤å³¹¡B³¯©É»«¡Bªô«Ø¶£¡B³¯¬F¾§¡B林õ¥Á
°ê立¥x北¬ì§Þ¤j¾Ç ¥ú¹q¤uµ{¨t
ºKn
¥Ø«eª¿§÷料»s§@¤§³æ¥ú¤l³·±Y«¬ÀË¥ú¤G·¥Åé¤w¬Û·í¦¨¼ô¡A¦ýªiªø¶W¹L1100
nm®É¦]¨ä³æ¥ú¤l°»´ú®Ä率(Single
Photon Detection Efficiency; SPDE)·¥§CµLªkº¡¨¬«Ü¦hÀ³¥Î¡C¶Ç²Î1300-1550
nm(ëã©Î¯~¤Æä¡ñS)³·±Y«¬ÀË¥ú¤G·¥Åé°¾À£¤j©ó±Y¼ì¹qÀ£®É¡AÁö¥i·í³æ¥ú¤l°»´ú¥Î¦ý¨ä·tÂI數(dark
counts)¤´°¾°ª¤Î³æ¥ú¤l量¤l®Ä率°¾§C¤§¯ÊÂI¡C¥»論¤å¡A§ÚÌ利¥Î·Ã»k¨èÅýªí±§Î¦¨¥W狀¡A¦bÂǥѤ@¦¸¾NÂX´²Åýµ²ºc§Î¦¨¯B¦¡Å@Àô(Floating
Guard-Ring)©óInP¿¼W¼h(Multiplication
Layer)¡A¦¹µ²ºc¥i§í¨îÃä½t±Y¼ì(Edge
Breakdown)¤Î¹ï¼W益ÀW¼e¤Î量¤l®Ä率¦³«Ü¤j§ïµ½¡A²Å¦X¥¼來量¤lÆ_°Í¤À§G(Quantum
Key Distribution; QKD)À³¥Î¤§³æ¥ú¤l°»´ú¯S©Ê¡A§ÚÌ´£©Ò¬ã»s¥X¤§SAGCMµ²ºc³æ¥ú¤l³·±Y«¬ÀË¥ú¤G·¥Åé¡A¨ä¯S©Ê¦p¤U¡G·t¹q流(ID
< 22
pA @-5V, < 7 nA @0.9 VBR)¡B¼W益ÀW¼e¼¿n(Gain
Bandwidth Product; GBW)¬ù56
GHz¡C¦b-20¢J®É¡A¶WÃB°¾À£(Excess
Bias)¬°0.2V¡A¨ä·tp數率=0.52¡Ñ106
c/s¡C
2009-029
µµ¥~¥ú雷®g·Ó®gf¨ÃÀô¤B²m¥úªi¾É¤¸¥ó¼ö¥ú®ÄÀ³¤§¬ã¨s
¼ï³§Ó ¤ýºû·s
°ê立¥xÆW¤j¾Ç¹q¤l¤uµ{¬ã¨s©Ò奈¦Ì¹q¤l²Õ
ºKn¡G
¥»論¤å±´°Q¥Hµµ¥~¥ú雷®g·Ó®gªk©Ò»s³yf¨ÃÀô¤B²m¥úªi¾É§@¬°¼ö¥ú¶}Ãöªº¥i行©Ê¡C¥Dn¤u§@¬O¥H¹ê§@¤è¦¡Æ[¹îf¨ÃÀô¤B²mª½ªi¾É©M2¡Ñ2
¦h¼Ò¤z¯A¤¸¥óªº¼ö¥ú®ÄÀ³¡C¦bª½ªi¾É¤è±¡A±´°Q¿é¤J¥\率»P¿é¥X¥\率ªºÃö«Y¡Cµ²ªGµo²{¦b¿é¤J¥\率¬°100
mW ®É¡A¿é¥X¥\率Åܤƥi¹F12
dB¡F¦Ó¦b2¡Ñ2
¦h¼Ò¤z¯A¤¸¥ó«h¬O±´°Q¨ä切´«¯S©Ê¡A¦b¬Û¦P¿é¤J¥\率®É¡A¥i¥H¬Ý¨ì¿é¥X¥ú¥\率¤j¤p¤¬´«ªº²{¶H¡C
2009-030
·¨Ä£ªi1 ¡B¸©w»¨2
1¤¤µØ¬ì§Þ¤j¾Ç ¹q¤l¤uµ{¬ã¨s©Ò
2¤¤µØ¬ì§Þ¤j¾Ç
¹q¤l¤uµ{¬ã¨s©Ò¬ã¨s¥Í
ºKn
¥»¤å°w¹ï¦h¸üªi¤À½X¦h«¶i±µ¨t²Î(multicarrier
code division multiple access , MC-CDMA)ªº¤WÃì¸ô(up-link)«H¸¹¶Ç¿é©ó°I¸¨³q¹D¤U°µ©Ê¯à¤ÀªR¡C³q¹D¼Ò«¬¤¤¡A°²³]¦UÓ¤l¸üªi«H¸¹¬°¸g¹L¤¬¬Û¿W¥ßªº³§B(Weibull)°I¸¨³q¹D¡A¦¹¼Ò«¬¦b¯S©wªº±¡ªp¤U¬°·ç§Q(Rayleigh)³q¹D¼Ò«¬¡A¯à°÷¾A·íªº´yzÀW²v¿ï¾Ü©Ê³q¹D¡C¦b±µ¦¬¾÷ºÝ¨Ï¥Î³Ì¤j¤ñ¨Ò¦X¦¨¾¹(maximal
ration combiner, MRC)¤Îµ¥¼W¯q¦X¦¨¾¹(equal
gain combiner, EGC)¡A¨Ã°²³]¬°¦P½Õ(coherent)±µ¦¬¡A¯à°÷ºë·Ç¦ôp¨Ï¥ÎªÌ«H¸¹ªº¬Û¦ì¡A¥B¤l¸üªi¨S¦³ÀW²v°¾²¾ªº°ÝÃD¡C
¾ãÅé¦Ó¨¥¡A¦h¸üªi¤À½X¦h«¶i±µ¨t²Î¦b³§B°I¸¨³q¹D¤U¡AÀHµÛ¤l¸üªi¼Æ¥Ø¶V¤j¡A¨t²Î©Ê¯à¤Î®e¶qªí²{¤]¶V¦n;·í§Îª¬°Ñ¼Æ
Åܤj¡A©Ê¯à¤]¸òµÛÅܦn¡A¥B¨Ï¥Î³Ì¤j¤ñ¨Ò¦X¦¨¾¹¤ñµ¥¼W¯q¦X¦¨¾¹¦³¸û¦nªº©Ê¯à¤Î®e¶qªí²{¡C
2009-031
Performance
Analysis of Coherent DS-CDMA over Weibull Multipath Fading
·¨Ä£ªi ¡BÁ²EÃü
¤¤µØ¬ì§Þ¤j¾Ç
ºKn
¥»½×¤å¥Dn¬ã¨s©ó¦P½Õª½±µ§Ç¦C¤À½X¦h«¶i±µ¨t²Î(DS-CDMA)¦b³§B¦h¸ô®|°I¸¨³q¹D¤¤¶i¦æ¦ì¤¸¿ù»~²v(BER)©Ê¯à¤ÀªR¡A°²³]°I¸¨³q¹D¬°ÀW²v¿ï¾Ü©Ê¡BºC³t°I¸¨¡A¨C¤@±ø¸ô®|«H¸¹¨ü¨ì°I¸¨ªºµ{«×µø¬°¿W¥ß¡A¦b±µ¦¬¸Ñ½Õ³¡¥÷¬O¨Ï¥Î¯Ò§Î(RAKE)±µ¦¬¾÷¡C
¬ã¨sµ²ªGÅã¥Üª½±µ§Ç¦C¤À½X¦h«¶i±µ¨t²Î¦b³§B¦h¸ô®|°I¸¨³q¹D¤U¡AÀHµÛ§Îª¬°Ñ¼Æ
ȼW¥[©Ê¯à±N¦³©Ò§ïµ½¡F¦Ó¥B±µ¦¬¾÷¤À¤ä(finger)¼Æ¥Ø·U¦h¡A©Ê¯à§ïµ½¤]·U¦h¡A¦ý¬O·í¨Ï¥ÎªÌ¼Æ¥Ø·U¦h®É¡A©Ê¯à·|ÀHµÛ¨Ï¥ÎªÌ¼Æ¥Øªº¼W¥[¦Ó°§C¡C
2009-032
MACROBUTTON
MTEditEquationSection2 Equation
Chapter 1 Section 1 SEQ MTEqn \r \h \* MERGEFORMAT SEQ
MTSec \r 1 \h \* MERGEFORMAT SEQ MTChap \r 1 \h \* MERGEFORMAT
¥H¤Gºû§C³qÂoªi¾¹¹ê²{DVB-T¨t²Î¤§³q¹D¦ô´ú
°ª¥Ã¦w¡B´öªÃ¿Ù
¨p¥ßªø©°¤j¾Ç¹q¾÷¤uµ{¬ã¨s©Ò
ºKn
¥»½g½×¤å¬O¥HDVB-T(Digital
Video Broadcasting-Terrestrial)¨t²Î¬°¨Ò¡A¥Î¤@Ó¤Gºû§C³qÂoªi¾¹¨Ó¤º´¡¥X³q¹DÅTÀ³¡A§ÚÌ¥Dn¦b©ó±´°Q¦p¦ó®Ú¾Ú°T¸¹¡u¤GºûÀWÃСv¤§±¡ªp¨Ó³]p¦¹¤Gºû§C³qÂoªi¾¹¡C³o¤Gºû§C³qÂoªi¾¹¬O¥Ñ¤@Ӯɶ¡ºû«×§C³qÂoªi¾¹¥H¤Î¤@ÓÀW²vºû«×§C³qÂoªi¾¹©Ò²Õ¦¨ªº¡A¦]¦¹¦b®É¶¡¶b©MÀW²v¶b¦U°µ¤@¦¸Âoªi«K¥i¹F¨ì¤GºûÂoªiªº®ÄÀ³¡C¸g¥Ñ¨t²Î¼ÒÀÀ¥i¥H¬Ý¥X¥»½g©Ò³]pªºÂoªi¾¹¤ñ¤@ºû¥H¤Î¤Gºû½u©Ê¤º´¡ªº®ÄªG¨Óªº¦n¡C
2009-033
¨ã¦P½Õ½¢¦X®ÄÀ³¤§Ås¦±¦¡¦h¼Ò¤z¯A¸Ñ¦h¤u¤¸¥ó¤§¬ã¨s
§õ©ø¯q¡BªL¸s¿[¡B
ªL©[¦¨¡B¸â³Í¥þ
¡BªL®Ë·ç¡B§õ°¶¸Î
¤¤µØ¬ì§Þ¤j¾Ç
¾÷¹q¥ú¬ã¨s©Ò
ºKn
¥Ø«e¥úªi¾É¿nÅé¥ú¾Ç¤¸¥ó¤j¦h¬O¨ã¦³Ås¦±§Î¦¡ªºªi¾Éªº³¡¤À¡A©Ò¥HÅs¦±
§Î¦¡ªºªi¾É¦b¤¸¥ó³]p¤WÅã±o®æ¥~«n¡C¤j¨¤«×¡B§C·l¯Ó¬OÅs¦±ªi¾É³]pªº«ÂI¡A¦Ó¦b¶Ç²ÎÅs¦±ªi¾É³]p¤WÅs¦±ªº¨¤«×¥²¶·¨î¦b¨â«×¥H¤º¡A§_«h·í¨¤«×¹L¤j®É·|¦³ÄY«ªº¿ç®g¼ÒºAªº·l¥¢¡A¥»½×¤åÂǥѦP½Õ½¢¦X®ÄÀ³ªº¤è¦¡¨Ó§ïµ½¤Wz¤§¯ÊÂI¡C
¥»½×¤åÂǥѥú§ô¶Ç¼½ªk(BPM)¨Ó¼ÒÀÀ¤ÀªR³]p¡A¥H¦h¼Ò¤z¯Aµ²ºc¨Ó³]pÅs¦±¦¡¸Ñ¦h¤u¾¹¤¸¥ó¡A·í¿é¤J¥ú¤À§O¬°1.55£gm¤Î1.31£gmªiªø¡A¨äªi¾ÉÅs¦±¨¤«×¬°5¢X®É¡A³o¨âÓªiªøªº¶Ç¿é®Ä²v¦³94¢H¥H¤W¡C
2009-034
³n©Ê¹q¤lÅX°ÊIC«Ê¸Ë»sµ{¥i¾a«×¤§¬ã¨s»P§ïµ½
À¹»·ªF,
ªL²»°¶
1Department
of Electro-Optical Engineering, Vanung University, TaoYuan,
¸â±Ò©ú,
§fÌɾË
2Kenmec
Technology co., LTD., TaoYuan, Taiwan, 300, R.O.C
ºKn
³n©Ê¹q¤lªºÀ³¥Î¤é¯q´¶¤Î¡A¨ä¬ÛÃöÀ³¥Î¥]¬A°·«OIC¥d¡B´¹¤ù«H¥Î¥d¡B¨¤ÀÃÒ¡B¹q¤l²{ª÷ÀxÈ¥d¡B«O±Kªºªù¸T¥d¤Î¨¥÷¿ëÃÑ¥dµ¥µ¥ªº´¼¼z«¬¥d¤ù¡A©Ò¨Ï¥Îªº³£¬O¥i¼¸¦¡³n©Ê¹q¤l¡C¥Ñ©ó´¼¼z¥d¥i¥H§@Àx¦s¡BÅÞ¿è¹Bºâ¡A¾Ö¦³°ª¦w¥þ©Ê¡BÄâ±a¤è«K¤Î¤@¥d¦h¥Îµ¥¯S©Ê¡C¤£¦ý§ïÅܧÚÌ®ø¶O¼Ò¦¡¡A¤]¼vÅT¤F§Ú̪º¥Í¬¡²ßºD¡A©Ò¼çÂ꺥«³õ°Ó¾÷§ó¬O¼t°Ó©ÒÁ»¿Ì¡A©Ò¥H¥Ø«e´¼¼z¥dÀ³¥Î±Û·±q¼Ú¬w©M¨È¬w³vº¥½¯©µ¦Ü¥þ²yªº²{¶H¬Ý¨Ó¡A¬Û«H¥¼¨Ó³n©Ê¹q¤l§Þ³N¡A¦b¥þ²y¥H³Ð·s¤Î§ó¨ã´¼¼zªº¤è¦¡³Q¨Ï¥Îªº®É¥N§Y±N¨ÓÁ{¡C
³n©Ê¹q¤l¡]Flexible
Electronics¡^¤Î³n©ÊÅã¥Ü§Þ³N¬OÄ~¥b¾ÉÅé»P¥±Åã¥Ü¾¹¤§«áªº¤U¤@Ó·s¿³²£·~¡A¤u¬ã°|q¤F¡u
2015
¦~³n¹q·s¥Í¬¡¡vp¹º¡AnÅý³n©Ê¹q¤l¦¨¬°¥xÆWªº²Ä¤TÓ¥ü¤¸²£·~¡A³n©Ê¹q¤l¾ã¦X¤F¥ú¡B¹q¡B·P´úµ¥¥\¯à¡A¥[¤W¨ä¥i¼¸¦±¤Î»´¶qÁ¡«¬ªº¯S¦â¡A¶}³Ð¤F¹q¤l¥þ·s¤§À³¥Î»â°ì¡C
¥»¬ã¨s¦b³n©Ê¹q¤l¤Î³n©ÊÅã¥Ü¾¹µ²¦X´¼¼z¥dªºI´º¤U¥HÂд¹§Þ³N»P³n½¤ÅX°ÊIC¤º¤Þ¸}«Ê¸Ë§Þ³N(Chip
on Film Inner Lead bonding;COF ILB)°w¹ï´¼¼z¥d¤º³¡³n©Ê¹q¤l¼Ò²Õ©Ò²£¥Í¤§¥i¾a«×°ÝÃD»P¥¢®Ä¼Ò¦¡§Q¥ÎDe-cap»PCross-section¤ÀªRì¦]¨Ã§ïµ½»sµ{¤W¤§¯Ê¥¢¡C
¡@